NDLI: Conduction mechanism of anisotropic conductive adhesives (ACAs): conductor ball deformation and build-up of contraction stresses

Content Provider	IEEE Xplore Digital Library
Author	Kyung-Wook Paik Woon-Seong Kwon
Copyright Year	2005
Description	Author affiliation: Dept. of Mater. Sci. & Eng., Korea Adv. Inst. of Sci. & Technol., Daejon, South Korea (Woon-Seong Kwon)
Abstract	In this paper, the effects of ACA conductor ball deformation and build-up of contraction stresses on ACA conduction is discussed. Precise ACA conductor ball deformation was measured using a nano-indentation machine. Better electrical contact resistance model of ACAs can be obtained using measured deformation behavior of ACA conductor balls. In addition, contraction stresses of ACAs during thermal curing are important factor determining the ACA contact resistance. Both ACF thickness shrinkages and modulus changes of four kinds of ACFs with different thermo-mechanical properties were experimentally investigated using thermo-mechanical and dynamic mechanical analysis. Based on an incremental approach to linear elasticity, contraction stresses of ACAs developed along the thickness direction were numerically predicted. It is found that contraction stresses of ACAs were developed during the cooling process from the glass transition temperature of ACAs to room temperature. The build-up of contraction stresses below Tg was strongly dependent on both coefficient of thermal expansion (CTE) and elastic modulus (E) of ACAs. A nanoscale deformation field of thin ACF layers was obtained to measure the contraction stresses experimentally using a phase shifting moire technique. Good agreement between the contraction stresses predicted from an incremental approach and the actual vertical stresses measured from a phase shifting moire analysis was obtained. Therefore, full temperature-evolution of contraction stress based on the incremental approach to linear elasticity is reliable and thereby can be used to predict the contraction stress behavior of polymeric ACF materials. As a summary, better understanding of ACA contact resistance can be achieved by analyzing conductor ball deformation and contraction stresses analysis.
Starting Page	214
Ending Page	220
File Size	2587590
Page Count	7
File Format	PDF
ISBN	0780390857
ISSN	15505723
e-ISBN	0780390865
DOI	10.1109/ISAPM.2005.1432078
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2005-03-16
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Anisotropic magnetoresistance Conductive adhesives Conductors Thermal stresses Electrical resistance measurement Contact resistance Thermomechanical processes Elasticity Temperature Stress measurement
Content Type	Text
Resource Type	Article

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