NDLI: A study of advanced ALIVH(R) interconnection technology

Content Provider	IEEE Xplore Digital Library
Author	Ochi, S. Echigo, F. Nakamura, T. Tomita, Y. Andoh, D.
Copyright Year	2002
Description	Author affiliation: Devices Dev. Center, Matsushita Electr. Ind. Co. Ltd., Osaka, Japan (Ochi, S.)
Abstract	We have developed the advanced ALIVH interconnection technology using the new functional materials. The ALIVH (Any Layer Interstitial Via Hole) substrate was developed and introduced into the market in 1996. The ALIVH substrate is a multi layered organic substrate with interstitial via holes in any layers. This substrate has a higher density and performance. The ALIVH substrate is constituted with the key technologies of the non-woven aramid-epoxy prepreg as the insulator material, the via hole drilling process using CO/sub 2/ laser and the interconnection technology using conductive copper paste. For the interconnection using the conductive paste, to compress the interstitial via hole and preserve its shape effectively is essential. We reported the interconnection technology mainly using aramid-epoxy prepreg in the previous papers. In addition, in order to realize the high performance of the PCBs, we have studied the interconnection technology using the new functional materials. As a result, by controlling the thickness of the resin layer and the viscosity of the resin, the electric interconnections were completed. Now, we are progressing with the ALIVH interconnection technology using the various functional materials in order to reply the several demands on electronic equipment. In this paper, we will introduce the interconnection technology of the advanced ALIVH substrate.
Sponsorship	IEEE Components, Packaging & Manuf. Technol. (CPMT) Packaging Res. Centr at Georgia Tech (USA)
Starting Page	356
Ending Page	361
File Size	520662
Page Count	6
File Format	PDF
ISBN	0780374347
DOI	10.1109/ISAPM.2002.990411
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2002-03-03
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Conducting materials Resins Insulation Optical materials Drilling Copper Shape Paper technology Thickness control Viscosity
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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