NDLI: Thermal management coatings via combustion chemical vapor deposition (CCVD)

Content Provider	IEEE Xplore Digital Library
Author	Yong Dong Jiang Moore, E.P. Jones, M.B. Deshpande, G.N. Polley, T.A. Hunt, A.T.
Copyright Year	2002
Description	Author affiliation: MicroCoating Technol. Inc., Atlanta, GA, USA (Yong Dong Jiang)
Abstract	Thermal management, especially for power systems, is a major issue for electronic packaging. It requires electrically insulating and thermally conductive materials with high breakdown strength and thermal conductivity. Conventional insulator materials for circuits such as epoxy, FR5, and gas, are poor thermal conductors. The alternatives, aluminum nitride, synthetic diamond and beryllia, are expensive, limited in size, and difficult to process. MCT, in conjunction with the U.S. Office of Naval Research and the University of Arkansas, is modifying its patented CCVD process to create an electrically insulating coating with relatively high thermal conductivity and breakdown voltage directly on to the base plate with no post deposition processing. The power and control circuit interconnects and components are to be applied directly onto the insulating layer. The preliminary results, measured on one-inch square coupons, are promising. The ceramic/polymer composite has excellent adhesion to polished Al-SiC substrate (>25 MPa), a breakdown voltage of higher than 1000 V, a leakage current less than 20 nA at 1000 V bias, and a substrate/coating thermal conductivity of 110 W/m K.
Sponsorship	IEEE Components, Packaging & Manuf. Technol. (CPMT) Packaging Res. Centr at Georgia Tech (USA)
Starting Page	172
Ending Page	177
File Size	700596
Page Count	6
File Format	PDF
ISBN	0780374347
DOI	10.1109/ISAPM.2002.990382
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2002-03-03
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Thermal management Coatings Combustion Chemicals Thermal conductivity Electronic packaging thermal management Power system management Conducting materials Thermal management of electronics Dielectrics and electrical insulation
Content Type	Text
Resource Type	Article

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