NDLI: Development and application by ink-jet printing of advanced packaging materials

Content Provider	IEEE Xplore Digital Library
Author	Hayes, D.J. Grove, M.E. Cox, W.R.
Copyright Year	1999
Description	Author affiliation: MicroFab Technol. Inc., Plano, TX, USA (Hayes, D.J.)
Abstract	High temperature ink-jet based printing processes (MicroJet) and custom polymer formulations have been developed for use in the fabrication of high-density microelectronic and optoelectronic packages. The enabling technologies for this work have been the development of a high-temperature (to 300/spl deg/C) print head and a set of UV-curing polymeric and oxide-filled formulations satisfying the rheological requirements for application by MicroJet. MicroJet processes have been utilized in the printing of solder bumps and vias, micro-optical interconnects, dielectric coatings, passive microelectronic elements, and adhesives. Potential applications of MicroJet processes and materials include: integrated circuit and chip-scale packaging, optical interconnect fabrication, printed wiring board manufacturing, and flat panel display assembly. The inherently data-driven nature of MicroJet processes lead to higher levels of process integration, lower costs, and increased manufacturing flexibility. Commercial platforms exist for print-on-the-fly solder deposition at rates of over 400 bumps/sec, and similar systems for high speed printing of polymers are under development. The range of packaging applications addressable by MicroJet technology is set to expand rapidly as printable feature sizes are reduced and as new MicroJetable material formulations are developed to meet a growing set of applications.
Starting Page	88
Ending Page	93
File Size	1216720
Page Count	6
File Format	PDF
ISBN	0930815564
DOI	10.1109/ISAPM.1999.757293
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1999-03-14
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Ink jet printing Polymers Packaging Optical device fabrication Microelectronics Manufacturing processes Temperature Rheology Integrated circuit interconnections Dielectrics
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Micro-jet printing of polymers for electronics manufacturing

Rapid prototyping of multichip packages using computer-controlled, ink jet direct-write

Microjet printing of micro-optical waveguides

Investigation of the flow properties of adhesives in electronic packaging

Microelectronic packaging trends: Materials and Processes

All-polymer thin film transistors fabricated by high-resolution ink-jet printing

Electrically Conductive Formulations Filled Nano Size Silver Filler for Ink-Jet Technology

An all-organic technology platform for electronic devices manufacturing

Investigation of ink-jet printing of self-assembled monolayers for copper circuit patterning

Development and application by ink-jet printing of advanced packaging materials

Similar Documents

Micro-jet printing of polymers for electronics manufacturing

Rapid prototyping of multichip packages using computer-controlled, ink jet direct-write

Microjet printing of micro-optical waveguides

Investigation of the flow properties of adhesives in electronic packaging

Microelectronic packaging trends: Materials and Processes

All-polymer thin film transistors fabricated by high-resolution ink-jet printing

Electrically Conductive Formulations Filled Nano Size Silver Filler for Ink-Jet Technology

An all-organic technology platform for electronic devices manufacturing

Investigation of ink-jet printing of self-assembled monolayers for copper circuit patterning

Development and application by ink-jet printing of advanced packaging materials