NDLI: Challenges in the packaging of MEMS

Content Provider	IEEE Xplore Digital Library
Author	O'Neal, C.B. Malshe, A.P. Singh, S.B. Brown, W.D. Eaton, W.P.
Copyright Year	1999
Description	Author affiliation: Center of High Density Electron., Arkansas Univ., Fayetteville, AR, USA (O'Neal, C.B.)
Abstract	Unlike IC packaging, MEMS dice must interface with the environment for sensing, interconnection, and/or actuation. MEMS packaging is application specific and the package provides the physical interface of the MEMS device to the environment. In the case of a fluid mass flow control sensor, the medium flows into and out of the package. This type of packaging is referred to as media compatible packaging. Harsh environments may create different challenges for the packaging of MEMS. In addition to challenges related to the MEMS chip environment and interfacing with that environment, challenges also exist inside the MEMS package, such as die handling, die attach, interfacial stress, and outgassing. These new challenges in MEMS packaging need immediate research and development efforts. To date, most of what is known about MEMS packaging remain proprietary secrets and published literature is scarce. The challenges of MEMS packaging have been known for some time, but little open research has been done to collect data and work toward meeting these challenges. A disproportionality exists between money spent on MEMS packaging and time spent researching MEMS packaging. Currently, the cost of MEMS packaging typically accounts for 75% or more of the device sale price. MEMS packaging is already far behind the capabilities of MEMS designers, and it is the purpose of this paper to share the challenges of MEMS packaging and create an awareness and an interest in MEMS packaging within the packaging community.
Starting Page	41
Ending Page	47
File Size	681657
Page Count	7
File Format	PDF
ISBN	0930815564
DOI	10.1109/ISAPM.1999.757284
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1999-03-14
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Micromechanical devices Integrated circuit packaging Microelectromechanical devices Fluid flow control Weight control Microassembly Stress Research and development Costs Marketing and sales
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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