NDLI: Multi-layered structure: adhesive selection and process mechanics [HDI]

Content Provider	IEEE Xplore Digital Library
Author	Manjula, S. Sundararaman, V. Sitaraman, S.K. Wong, C.P. Wu, J. Pike, R.T.
Copyright Year	1999
Description	Author affiliation: George W. Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA (Manjula, S.)
Abstract	The fabrication of high-density interconnect structures typically involves sequential processing of alternate layers of thin organic dielectric materials and conducting copper lines. With the continued push toward low-cost fabrication, large-area processing of thin-film materials is being aggressively pursued by the electronic packaging industry. The objective of the ongoing work at Georgia Tech in collaboration with the MCM-D consortium is to develop innovative materials, models, and processing techniques to facilitate large-area processing of alumina and silicon tiles. As the alumina and silicon tiles are commercially available in smaller dimensions, a palletization approach has been developed to facilitate large-area processing. In the palletization approach, alumina and silicon tiles are attached to re-usable glass pallets with an in-house developed thermally-stable, reworkable, and highly-compliant adhesive.
Starting Page	48
Ending Page	52
File Size	503016
Page Count	5
File Format	PDF
ISBN	0930815564
DOI	10.1109/ISAPM.1999.757285
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1999-03-14
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Dielectric materials Silicon Tiles Fabrication Conducting materials Copper Dielectric thin films Electronics packaging Electronics industry Textile industry
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

High-temperature, low-modulus adhesive attach for large-area thin-film processing on silicon and alumina tiles

Palletized approach to large-area thin-film processing-materials, modeling, and measurement

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