NDLI: Surface mount conductive adhesives with superior impact resistance

Content Provider	IEEE Xplore Digital Library
Author	Vons Jr., S.A. Tong, Q.K. Kuder, R. Shenfield, D.
Copyright Year	1998
Description	Author affiliation: Nat. Starch & Chem. Co., Bridgewater, NJ, USA (Vons, S.A., Jr.)
Abstract	Surface mount conductive adhesives (SMCAs) provide an environmentally friendly solution for interconnections in electronic applications. In addition, SMCAs offer other attractive technical advantages over conventional metal solders including low temperature processing, fine pitch capability, and enhanced thermal cycling performance. However, one key obstacle to general replacement of metal solders by SMCAs in electronic applications is the poor impact resistance of the adhesive interconnections, which is characterized by the industry standardized "drop test" A structure-property-performance study of SMCAs was undertaken with the goal of identifying the key material properties for improved "drop test" performance. This study identified energy dissipation as the key factor governing "drop test" performance and, accordingly, reduced modulus and increased loss factor to be the material properties of importance. The above findings are based on analysis of a physical model of the SMCA assembly used for the "drop test", and further verified by experimental results on a series of exploratory SMCA materials. This study not only led to a thorough understanding of the key performance requirements of the material, but also yielded novel adhesive materials with superior impact resistance capable of maintaining adhesive interconnections during "drop test".
Starting Page	261
Ending Page	267
File Size	565828
Page Count	7
File Format	PDF
ISBN	0780347951
DOI	10.1109/ISAPM.1998.664467
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1998-03-18
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Surface resistance Conductive adhesives Materials testing Electronic equipment testing Material properties Temperature Industrial electronics Electronics industry Metals industry Energy dissipation
Content Type	Text
Resource Type	Article

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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