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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Mezhiba, A.V. Friedman, E.G. |
| Copyright Year | 2003 |
| Description | Author affiliation: Dept. of Electr. & Comput. Eng., Rochester Univ., NY, USA (Mezhiba, A.V.; Friedman, E.G.) |
| Abstract | The design of robust and area efficient power distribution networks for high speed, high complexity integrated circuits has become a challenging task. The integrity of the high frequency signals depends upon the impedance characteristics of the on-chip power distribution networks. The electrical characteristics of these multi-layer power distribution grids and the relevant design implications are the subject of this paper. Each grid layer within a multilayer power distribution grid typically has significantly different electrical properties. Unlike single layer grids, the electrical characteristics of a multi-layer grid can vary significantly with frequency. As the frequency increases, a large share of the current flow is transfered from the low resistance upper layers to the low inductance lower layers. The inductance of a multi-layer grid therefore decreases with frequency, while the resistance increases with frequency. Therefore, as compared to power distribution grids built exclusively in the upper, low resistance metal layers, a multi-layer power distribution grid extending to the lower interconnect layers exhibits superior high frequency impedance characteristics. An analytic model is also presented to determine the impedance characteristics of a multi-layer grid from the inductive and resistive properties of the comprising individual grid layers. |
| Sponsorship | IEEE Circuits & Syst. Soc Mahanakorn Univ. Technol |
| File Size | 367161 |
| File Format | |
| ISBN | 0780377613 |
| DOI | 10.1109/ISCAS.2003.1206321 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2003-05-25 |
| Publisher Place | Thailand |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Electric variables Power distribution Frequency Impedance Power systems Electric resistance Inductance Robustness High speed integrated circuits Network-on-a-chip |
| Content Type | Text |
| Resource Type | Article |
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