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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Mingliang Wang Jiping Li Ngo, K.D.T. Huikai Xie |
| Copyright Year | 2010 |
| Description | Author affiliation: Department of Electrical and Computer Engineering, Virginia Tech (Ngo, K.D.T.) || Department of Electrical and Computer Engineering, University of Florida (Mingliang Wang; Jiping Li; Huikai Xie) |
| Abstract | A novel silicon-based inductor, power inductor in silicon, or PIiS, has been proposed and experimentally demonstrated. The PIiS is fabricated at wafer level using a silicon molding micromachining technique, in which 200 µm thick copper windings are embedded into a silicon substrate and both sides of the substrate are capped with a polymer-magnetic power composite. Through-silicon vias (TSVs) and copper routings are also added so that a PIiS can be directly used as a surface mountable packaging substrate. A 3×3×0.6 $mm^{3}$ PIiS with a measured inductance of 390 nH has been fabricated. The Q factor of this PIiS is 10 at 6 MHz. An ultra compact buck converter has been made by surface mounting off-shelf power ICs and capacitors on a PIiS. The buck converter is 3×3×1.2 $mm^{3},$ which has successfully delivered 500 mA at 1.8V with an 80% efficiency at 6 MHz. |
| Starting Page | 2036 |
| Ending Page | 2041 |
| File Size | 1025273 |
| Page Count | 6 |
| File Format | |
| ISBN | 9781424447824 |
| ISSN | 10482334 |
| DOI | 10.1109/APEC.2010.5433515 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2010-02-21 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Inductors Silicon Power supplies Copper Buck converters Micromachining Polymers Through-silicon vias Routing Packaging |
| Content Type | Text |
| Resource Type | Article |
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