NDLI: Simulation and measurements of the piezoelectric properties response (d/sub 33/) of piezoelectric layered thin film structures influenced by the top-electrode size

Content Provider	IEEE Xplore Digital Library
Author	Prume, K. Gerber, P. Kugeler, C. Roelofs, A. Bottger, U. Waser, R. Schmitz-Kempen, T. Tiedke, S.
Copyright Year	2005
Description	Author affiliation: AixACCT Syst. GmbH, Aachen, Germany (Prume, K.)
Abstract	The properties of piezoelectric thin film layered structures are in the focus of many investigations. Significant decreasing piezoelectric properties have been observed with decreasing top-electrode size. These results are obtained by measurements of the effective piezoelectric small-signal coefficient d/sub 33,eff/ and the piezoelectric large signal-strain S using a double-beam laser interferometer. Samples are investigated with squared top-electrodes with dimensions of 0.1 mm to 1 mm edge length. The loss of d/sub 33,eff/ is as high as 50 %, whereas the influence on the relative permittivity is only small. This work investigates this behaviour by calculating the influence of varying elastic and geometrical properties of substrate, electrodes, and piezoelectric thin film on the effective piezoelectric small-signal coefficient d/sub 33,eff/ by means of finite element simulations. Beside the clamping effect of the substrate under electrical operating conditions also the influence of thermally induced mechanical stresses after cooling from 4000/spl deg/C to room temperature is calculated. From measurements and simulations it can be concluded that the source of the pad size effect on the measured piezoelectric properties can he attributed to the mechanics of the layered structure.
Starting Page	7
Ending Page	10
File Size	536686
Page Count	4
File Format	PDF
ISBN	0780384105
ISSN	10994734
DOI	10.1109/ISAF.2004.1418325
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2004-08-23
Publisher Place	Canada
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Piezoelectric films Substrates Mechanical variables measurement Size measurement Permittivity Electrodes Finite element methods Solid modeling Clamps Thermal stresses
Content Type	Text
Resource Type	Article

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