NDLI: Miniaturized hybrid Antenna combining Si and IPD™ technologies for 60 GHz WLAN Applications

Content Provider	IEEE Xplore Digital Library
Author	Calvez, C. Person, C. Coupez, J. Gallee, F. Pilard, R. Gianesello, F. Gloria, D. Belot, D. Ezzeddine, H.
Copyright Year	2011
Description	Author affiliation: STMicroelectronics, Crolles, FRANCE (Pilard, R.; Gianesello, F.; Gloria, D.; Belot, D.) \|\| STMicroelectronics, Tours, FRANCE (Ezzeddine, H.) \|\| Lab-STICC UMR CNRS 3192, Telecom Bretagne / Microwave Department, Brest, FRANCE (Calvez, C.; Person, C.; Coupez, J.; Gallee, F.)
Abstract	This paper presents the design of a packaged antenna including glass substrate. A square patch antenna is implemented on glass substrate exploiting IPD™ technology, and excited by a coupling slot implemented on BiCMOS B9MW technology (Low Resistivity (LR) Si - ρ = 12 Ω.cm). The described solution solves the interconnection problem between Silicon Integrated Circuits (ICs) and the antenna. The excitation structure is integrated on Silicon substrate using conventional process, thus reducing insertion losses usually caused by flip-chip or assembling techniques. The second advantage of this solution is the co-integration of the coupling slot with the RF front-end. This permits to match the antenna input impedance to the PA output impedance, with consequently improved power budget efficiency. This antenna achieves a simulated gain of 5 dBi at 60 GHz and a relative bandwidth of 8 %. A preliminary antenna on alumina and glass substrates has been realized in order to verify the flip-chip assembly process. The measurements results are in good agreement with simulation.
Starting Page	1357
Ending Page	1359
File Size	499084
Page Count	3
File Format	PDF
ISBN	9781424495627
ISSN	19471491
e-ISBN	9781424495634
DOI	10.1109/APS.2011.5996542
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2011-07-03
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Silicon Substrates Arrays Antenna arrays Antenna measurements IPD™ technology millimeterwave hybrid antenna System in Package silicon substrate
Content Type	Text
Resource Type	Article

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