NDLI: Bond-and-transfer scanning probe array for high-density data storage

Content Provider	IEEE Xplore Digital Library
Author	Hsieh, G.-W. Ching-Hsiang Tsai We-Chih Lin Chao-Chiun Liang Yu-Wen Lee
Copyright Year	1965
Abstract	This paper reports a study of a wafer-level bond-and-transfer technique for scanning probe arrays and its future application on probe-based data storage. The bonding performance between sodium ion-rich glass and silicon-nitride-deposited silicon substrate has been characterized. The effects of tool pressure, bonding time, surface properties, and cleanliness were thoroughly discussed. Furthermore, the silicon-nitride-based scanning probe array with pyramidal tip and 1.5-/spl mu/m-thick cantilevers were successful bonded and transferred to Pyrex 7740 substrate by the optimized condition of wafer-scale electrostatic force bonding and transferring processes. The nano-patterning capabilities of scanning probe array for high-density data storage were also discussed.
Sponsorship	IEEE Magnetics Society
Starting Page	989
Ending Page	991
Page Count	3
File Size	844315
File Format	PDF
ISSN	00189464
Volume Number	41
Issue Number	2
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2005-02-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Memory Wafer bonding Silicon Glass Bonding forces Substrates Electrostatics Scanning probe microscopy Integrated circuit technology Temperature scanning probe array Data storage electrostatic force bonding
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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