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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Cheng-Syun Li Ming-Huang Li Cheng-Chi Chen Chi-Hang Chin Sheng-Shian Li |
| Copyright Year | 1980 |
| Abstract | We report a thermally driven and piezoresistively sensed CMOS-microelectromechanical systems (MEMS) resonator with quality factor Q >10000 and stopband rejection of 15 dB under CMOS-compatible bias voltage. The bias voltage requirement of this letter is two orders of magnitude lower than that of the previous CMOS-MEMS capacitively transduced resonators. In addition, the combination of the bulkmode resonator design and highQ SiO2/polysilicon structural material leads to resonator Q >10000, a key index for low-phasenoise oscillators and low-insertion-loss filters. The resonator with a center frequency at 5.1 MHz was fabricated using a standard 0.35 μm 2-poly-4-metal CMOS process, featuring low cost, batch production, fast turnaround time, easy prototyping, and MEMS/IC integration. To resolve the feedthrough issue often seen in conventional thermal-piezoresistive resonators: 1) separation of the heater and piezoresistor is first adopted because of the routing flexibility of the structural configuration offered by CMOS back-end-of-line materials and 2) fully differential measurement scheme is then applied to the proposed device, both of which enable a low-feedthrough level with 65-dB improvement as compared with its single-ended counterpart. |
| Sponsorship | IEEE Electron Devices Society |
| Starting Page | 192 |
| Ending Page | 194 |
| Page Count | 3 |
| File Size | 1315166 |
| File Format | |
| ISSN | 07413106 |
| Volume Number | 36 |
| Issue Number | 2 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2015-01-01 |
| Publisher Place | U.S.A. |
| Access Restriction | One Nation One Subscription (ONOS) |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Heating Thermal stability Materials CMOS integrated circuits Micromechanical devices Thermal resistance Piezoresistance Micro-electro-mechanical System CMOS-MEMS Micro-resonators Piezoresistive device Thermal stability Q factor Thermo-elasticity microelectromechanical system micro-resonators piezoresistive device thermal stability $Q$ factor thermo-elasticity |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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