NDLI: Mass Sensitivity Evaluation and Device Design of a LOVE Wave Device for Bond Rupture Biosensors Using the Finite Element Method

Content Provider	IEEE Xplore Digital Library
Author	Kui Han Yuan, Y.J.
Copyright Year	2001
Abstract	The LOVE wave devices based on a number of composite structures have been designed and simulated in this paper for use as a bond-rupture biosensor. Bond-rupture biosensors use acoustic energy to probe the bond strength between the sensor substrate and the analyte. The sensitivity and displacement of LOVE wave sensors can be implemented due to energy concentration inside a guiding layer on the surface of a piezoelectric crystal. The choice of substrate and guiding layer material is the critical basic elements in the proper design of a LOVE wave biosensor applications. Finite element method (FEM) is a suitable numerical method to analyze and design the LOVE wave device. A 3-D FEM model has been created and defined to simulate the displacement response of the acoustic wave system. The LOVE wave can be clearly observed, and the total surface displacement can reach a value of 10^-11m, which can easily induce the bond rupture between antibody and antigen. A 2-D model has been established to simulate the mass sensitivity with different composite structures of 128° YX LiNbO₃, 36° YX LiTaO₃, ST-quartz-PMMA and 128° YX LiNbO₃, and 36° YX LiTaO₃ and ST-quartz-SiO₂. These results indicate that the 128° YX LiNbO₃PMMA is the most suitable for bond rupture biosensors due to its high sensitivity and maximum displacement on the surface of piezoelectric crystal.
Sponsorship	IEEE Sensors Council
Starting Page	2601
Ending Page	2608
Page Count	8
File Size	3391887
File Format	PDF
ISSN	1530437X
Volume Number	14
Issue Number	8
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2014-01-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Load modeling Solid modeling Substrates Biosensors Sensitivity Surface acoustic waves sensitivity Bond rupture finite element method LOVE surface acoustic wave mass loading
Content Type	Text
Resource Type	Article
Subject	Instrumentation Electrical and Electronic Engineering

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Surface Acoustic Wave Delay Line for Bond Rupture Biosensors

Finite-Element Modeling of a Hexagonal Surface Acoustic Wave Device Based on ${rm LiNbO}_{3}$ Substrate

Design, Modeling, and Characterization of a Novel Circular Surface Acoustic Wave Device

Optimization of Sensitivity Induced by Substrate Strain Rate for Surface Acoustic Wave Yarn Tension Sensor

ZnO nanorod-based Love wave delay line for high mass sensitivity: a finite element analysis

Finite Element Modeling and Analysis of Surface Acoustic Wave Devices in CMOS Technology

Evaluation on mass sensitivity of SAW sensors for different piezoelectric materials using finite-element analysis

Erratum: Finite-element analysis of flat overlay waveguides for acoustic surface waves using acoustic surface impedance

A Novel Saw Device in CMOS: Design, Modeling, and Fabrication

Mass Sensitivity Evaluation and Device Design of a LOVE Wave Device for Bond Rupture Biosensors Using the Finite Element Method

Similar Documents

Surface Acoustic Wave Delay Line for Bond Rupture Biosensors

Finite-Element Modeling of a Hexagonal Surface Acoustic Wave Device Based on ${rm LiNbO}_{3}$ Substrate

Design, Modeling, and Characterization of a Novel Circular Surface Acoustic Wave Device

Optimization of Sensitivity Induced by Substrate Strain Rate for Surface Acoustic Wave Yarn Tension Sensor

ZnO nanorod-based Love wave delay line for high mass sensitivity: a finite element analysis

Finite Element Modeling and Analysis of Surface Acoustic Wave Devices in CMOS Technology

Evaluation on mass sensitivity of SAW sensors for different piezoelectric materials using finite-element analysis

Erratum: Finite-element analysis of flat overlay waveguides for acoustic surface waves using acoustic surface impedance

A Novel Saw Device in CMOS: Design, Modeling, and Fabrication

Mass Sensitivity Evaluation and Device Design of a LOVE Wave Device for Bond Rupture Biosensors Using the Finite Element Method