NDLI: A TSV-Based Bio-Signal Package With <formula formulatype=inline><tex Notation=TeX>$mu$</tex> </formula>-Probe Array

Content Provider	IEEE Xplore Digital Library
Author	Lei-Chun Chou Shih-Wei Lee Po-Tsang Huang Chih-Wei Chang Cheng-Hao Chiang Shang-Lin Wu Ching-Te Chuang Jin-Chern Chiou Wei Hwang Chung-Hsi Wu Kuo-Hua Chen Chi-Tsung Chiu Ho-Ming Tong Kuan-Neng Chen
Copyright Year	1980
Abstract	Bio-signal probes providing stable observation with high quality signals are crucial for understanding how the brain works and how the neural signal transmits. Due to the weak and noisy characteristics of bio-signals, the connected interconnect length between the sensor and CMOS has significant impact on the bio-signal quality. In addition, long interconnections with wire bonding technique introduce noises and lead to bulky packaged systems. This letter presents an implantable through-silicon via (TSV) technology to connect sensors and CMOS devices located on the opposite sides of the chip for brain neural sensing applications. With the elimination of traditional wire bonding and packaging technologies, the quality of bio-signal can be greatly improved.
Sponsorship	IEEE Electron Devices Society
Starting Page	256
Ending Page	258
Page Count	3
File Size	711327
File Format	PDF
ISSN	07413106
Volume Number	35
Issue Number	2
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2014-01-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Through-silicon vias Probes Arrays CMOS integrated circuits Etching Electrical resistance measurement Wires bio-signal probe TSV CMOS MEMS
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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