NDLI: Rapid Sintering Nanosilver Joint by Pulse Current for Power Electronics Packaging

Content Provider	IEEE Xplore Digital Library
Author	Yunhui Mei Yunjiao Cao Gang Chen Xin Li Guo-Quan Lu Xu Chen
Copyright Year	2001
Abstract	Sintering of nanosilver paste has been extensively studied as a lead-free die-attach solution for bonding semiconductor chips. The bonding process typically consists of a low-temperature drying step to remove organic solvents in the paste followed by sintering at around 250°C . Normally, a soak time of several minutes at the sintering temperature is necessary to establish strong bond strength by the conventional heating method. In this paper, we tested the feasibility of applying pulses of alternating electrical current through the nanosilver bonding layer to achieve strong joints in less than a second, not minutes. Experiments were carried out by joining rectangular copper blocks that were either coated with a layer of electroplated silver or without. A layer of nanosilver paste was stencil printed on one block, dried at temperature below 100°C, before the other copper block was placed on. The bonding members were then inserted under an alternating-current spot-welding machine for rapid joining with current pulses. Die-shear test was used to quantify the joint strength. Investigated processing variables on the joint strength were current level, current-on time, nanosilver bondline thickness, predrying temperature and time, and copper surface finish. Scanning electron microscopy was used to characterize the joint microstructure. It is suggestive that the current sintering of nanosilver paste could be used for rapid joining of metal-to-metal connection, such as bonding copper bus bars onto power electronics modules.
Sponsorship	IEEE Electron Devices Society IEEE Reliability Society
Starting Page	258
Ending Page	265
Page Count	8
File Size	962744
File Format	PDF
ISSN	15304388
Volume Number	13
Issue Number	1
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2013-01-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Silver Copper Joints Materials Educational institutions Surface cracks Power electronics rapid joining Current sintering lead-free low-temperature sintering nanosilver paste
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Safety, Risk, Reliability and Quality Electrical and Electronic Engineering

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