NDLI: Assessment of Influence of Impedance Mismatch in ULSI Devices on Electromigration of Copper Interconnection Lines

Content Provider	IEEE Xplore Digital Library
Author	Livshits, P. Rysin, A. Sofer, S. Fefer, Y.
Copyright Year	2001
Abstract	In this work, the impact of impedance mismatch between on-die CMOS drivers and driven transmission lines on electromigration (EM) and Joule-heating failure mechanisms has been qualitatively studied. Signals corrupted by the impedance mismatch were experimentally measured within a 45-nm CMOS technology ULSI test chip. The signals' current waveforms were obtained using a SPICE simulator. These voltage and current waveforms have been taken as a basis for our calculations. The results reveal that distortions of current shape, which are caused by the mismatched output impedance of a CMOS driver, lead to substantial aggravation of the EM and Joule heating in a driven line. Furthermore, it was found that the impedance mismatch causes serious modifications of current shape of a CMOS inverter connected to the far end of the line. This in turn aggravates both EM and Joule heating in the next-stage line that loads this CMOS inverter.
Sponsorship	IEEE Electron Devices Society IEEE Reliability Society
Starting Page	231
Ending Page	235
Page Count	5
File Size	426648
File Format	PDF
ISSN	15304388
Volume Number	13
Issue Number	1
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2013-01-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Impedance CMOS integrated circuits Power transmission lines Inverters Ultra large scale integration Reliability Electromigration on-die transmission lines Electromigration (EM) and Joule heating impedance matching integrated circuits
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Safety, Risk, Reliability and Quality Electrical and Electronic Engineering

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Aggravated Electromigration of Copper Interconnection Lines in ULSI Devices Due to Crosstalk Noise

Increased Resistive Losses of Copper Interconnects in ULSI Devices—A Reliability Issue

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Assessment of Influence of Impedance Mismatch in ULSI Devices on Electromigration of Copper Interconnection Lines

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