NDLI: Terahertz Characterization of Dielectric Substrates for Component Design and Nondestructive Evaluation of Packages

Content Provider	IEEE Xplore Digital Library
Author	Hejase, J.A. Paladhi, P.R. Chahal, P.
Copyright Year	2011
Abstract	In this paper, terahertz (THz) characterization of dielectric substrates, THz planar and quasi-optical components, THz probing of planar devices, and THz nondestructive evaluation (NDE) are demonstrated. In particular, the goals of this paper are: 1) characterization of dielectric substrates for THz packaging applications; 2) design, fabrication, and evaluation of THz components built using some of these dielectric substrates; and 3) the use of the dielectric characterization approach and dielectric properties in NDE of electronic packages. The background theory for characterizing dielectric substrates using THz time-domain signals is provided. The Nelder and Mead modified simplex optimization algorithm is utilized in order to extract the dielectric properties of different packaging materials encompassing organic, inorganic, and composite materials. A planar THz power splitter, a dielectric probe, and a low-cost polymer-based quasi-optical band-stop interference filter are demonstrated. THz NDE of electronics packages is demonstrated for packaging delamination and moisture ingression in dielectric films.
Starting Page	1685
Ending Page	1694
Page Count	10
File Size	982489
File Format	PDF
ISSN	21563950
Volume Number	1
Issue Number	11
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2011-11-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Dielectric constant Substrates Dielectric losses Optimization Dielectric measurements terahertz dielectric waveguides electromagnetic nondestructive testing Fourier transforms material characterization photonic crystal band-stop filter
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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Corrections to “Terahertz Characterization of Dielectric Substrates for Component Design and Nondestructive Evaluation of Packages” [Nov 11 1685-1694]

Photonic bandgap dielectric waveguide filter

Electromagnetic crystal (EMXT) waveguide band-stop filter

Development of a laminated waveguide

Multimodal Solution for a Waveguide Radiating Into Multilayered Structures—Dielectric Property and Thickness Evaluation

Terahertz Tube Lattice Fibers With Octagonal Symmetry

Complex permittivity measurements at Ka-Band using rectangular dielectric waveguide

Single-Mode Terahertz Bragg Fiber Design Using a Modal Filtering Approach

Wavelength filter using twin one-dimensional photonic crystal cavity silicon waveguides

Terahertz Characterization of Dielectric Substrates for Component Design and Nondestructive Evaluation of Packages

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Corrections to “Terahertz Characterization of Dielectric Substrates for Component Design and Nondestructive Evaluation of Packages” [Nov 11 1685-1694]

Photonic bandgap dielectric waveguide filter

Electromagnetic crystal (EMXT) waveguide band-stop filter

Development of a laminated waveguide

Multimodal Solution for a Waveguide Radiating Into Multilayered Structures—Dielectric Property and Thickness Evaluation

Terahertz Tube Lattice Fibers With Octagonal Symmetry

Complex permittivity measurements at Ka-Band using rectangular dielectric waveguide

Single-Mode Terahertz Bragg Fiber Design Using a Modal Filtering Approach

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Terahertz Characterization of Dielectric Substrates for Component Design and Nondestructive Evaluation of Packages