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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Yeong-Jyh Lin Sheng-Jye Hwang Huei-Huang Lee Durn-Yuan Huang |
| Copyright Year | 2011 |
| Abstract | The generalized Maxwell model and Williams-Ladel-Ferry (WLF) equation of epoxy molding compound (EMC) under different temperatures were first identified. Via measuring the loss and storage moduli of the specimens under different curing conditions, an equation relating the degree of cure to the relaxation modulus, called the cure shift factor (aC), was obtained. Considered with the WLF equation, which defines the temperature shift factor (aT), the total shift factor was proposed as the product of aT and aC. With this dualistic shift factor, the relaxation modulus of EMC under any degree of cure coupling with different temperatures could be defined. |
| Starting Page | 1755 |
| Ending Page | 1760 |
| Page Count | 6 |
| File Size | 443402 |
| File Format | |
| ISSN | 21563950 |
| Volume Number | 1 |
| Issue Number | 11 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2011-11-01 |
| Publisher Place | U.S.A. |
| Access Restriction | One Nation One Subscription (ONOS) |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Temperature measurement Mathematical model Electromagnetic compatibility Integrated circuit packaging Maxwell equations relaxation modulus Epoxy molding compound generalized Maxwell model integrated circuit packaging |
| Content Type | Text |
| Resource Type | Article |
| Subject | Industrial and Manufacturing Engineering Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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