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3D Printings: Binuclear Copper Complex Ink as a Seed for Electroless Copper Plating Yielding >70% Bulk Conductivity on 3D Printed Polymers (Adv. Mater. Interfaces 8/2018)
| Content Provider | Scilit |
|---|---|
| Author | Farraj, Yousef Layani, Michael Yaverboim, Avi Magdassi, Shlomo |
| Copyright Year | 2018 |
| Description | Journal: Advanced Materials Interfaces |
| Related Links | https://onlinelibrary.wiley.com/doi/pdfdirect/10.1002/admi.201870038 https://onlinelibrary.wiley.com/doi/pdf/10.1002/admi.201870038 |
| ISSN | 21967350 |
| e-ISSN | 21967350 |
| DOI | 10.1002/admi.201870038 |
| Journal | Advanced Materials Interfaces |
| Issue Number | 8 |
| Volume Number | 5 |
| Language | English |
| Publisher | Wiley-Blackwell |
| Publisher Date | 2018-04-23 |
| Access Restriction | Open |
| Subject Keyword | Journal: Advanced Materials Interfaces Manufacturing Engineering 3d Printings Copper Complex Inks Electroless Plating Heatâsensitive Substrates |
| Content Type | Text |
| Resource Type | Article |
| Subject | Mechanics of Materials Mechanical Engineering |