NDLI: Effects of Warpage on Fatigue Reliability of Solder Bumps: Experimental and Analytical Studies

Content Provider	IEEE Xplore Digital Library
Author	Wei Tan Ume, I.C. Ying Hung Wu, C.F.J.
Copyright Year	1999
Abstract	Out-of-plane displacement (warpage) has been a major thermomechanical reliability concern for board-level electronic packages. Printed wiring board (PWB) and component warpage results principally from coefficient of thermal expansion mismatch among the materials that make up the PWB assembly (PWBA). Warpage occurring during surface-mount assembly reflow processes and normal operations may lead to severe solder bump reliability problems. In this research, the effect of initial PWB warpage on the low cycle thermal fatigue reliability of the solder bumps in plastic ball grid array (PBGA) packages was studied using experimental and analytical methods. A real-time projection moire¿ warpage measurement system was used to measure the surface topology of PWBA samples at different temperatures. The thermal fatigue reliability of solder bumps was evaluated from experimental thermal cycling tests and finite element simulation results. Three-dimensional (3-D) models of PWBAs with varying board warpage were used to estimate the solder bump fatigue life for different types of PBGAs mounted on PWBs. In order to improve the accuracy of FE results, the projection moire¿ method was used to measure the initial warpage of PWBs, and this warpage was used as a geometric input to the finite element method. The simulation results were validated and correlated with the experimental results obtained using the projection moire¿ technique and accelerated thermal cycling tests. An advanced prediction model was generated to predict board level solder bump fatigue life based on the initial PWB warpage, package dimensions and locations, and solder bump materials.
Sponsorship	IEEE Components, Packaging, and Manufacturing Technology Society IEEE Components, Packaging and Manufacturing Technology Society
Starting Page	314
Ending Page	322
Page Count	9
File Size	1174704
File Format	PDF
ISSN	15213323
Volume Number	33
Issue Number	2
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2010-05-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Fatigue Electronic packaging thermal management Assembly Lead Testing Finite element methods Life estimation Thermomechanical processes Wiring Thermal expansion warpage prediction model solder bumps
Content Type	Text
Resource Type	Article
Subject	Electrical and Electronic Engineering

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in