NDLI: The Investigation of Nano-Roughening Effect on the Reliability Enhancement of Adhesive Bond for NEMS Manufacture Application

Content Provider	IEEE Xplore Digital Library
Author	Chia-Yeh Yang Yu-Ting Cheng Wen-Syang Hsu
Copyright Year	1999
Abstract	The paper shows the importance of nano-roughening on the bonding interface to the reliability enhancement of adhesive bond for ensuring the continuation of packaging shrinkage from MEMS to NEMS. The roughening is realized via a nonuniformly etching characteristic of PR which is etched and then utilized as an etching mask for following silicon etching process. Ultraviolet adhesive for silicon-to-glass bonding is utilized for the verification of the nano-roughening effect on NEMS hermetic encapsulation. The average roughnesses of the silicon substrate before and after roughening are 0.4 nm and 12.4 nm, respectively. Experimental results show that the roughness increase of silicon substrate can effectively provide more than 30% bonding strength enhancement and 30% leakage reduction. In addition, stamp-and-stick test shows that nano-roughening indeed provides a better adhesive characteristic that can further ensure the success of the stamp-and-stick process for nano/microfabrication.
Sponsorship	IEEE Components, Packaging, and Manufacturing Technology Society IEEE Components, Packaging and Manufacturing Technology Society
Starting Page	356
Ending Page	361
Page Count	6
File Size	2820415
File Format	PDF
ISSN	15213323
Volume Number	33
Issue Number	2
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2010-05-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Nanoelectromechanical systems Encapsulation Micromechanical devices Wafer bonding Etching Silicon Costs Pulp manufacturing Packaging Fabrication ultraviolet (UV) adhesive bonding Hermetic encapsulation nano-electromechanical systems (NEMS) manufacture nano-roughening scaling rule
Content Type	Text
Resource Type	Article
Subject	Electrical and Electronic Engineering

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