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Content Provider | IEEE Xplore Digital Library |
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Author | TĚapajna, M. Simms, R.J.T. Yi Pei Mishra, U.K. Kuball, M. |
Copyright Year | 1980 |
Abstract | A new methodology is developed to determine spatial location and properties of traps generated by electrical stressing of AlGaN/GaN high-electron mobility transistors, based on integrated optical and electrical analysis. Mild off-state stress increases irreversibly the number of traps located in the near-surface AlGaN region at the gate edge. A deep level with 0.45-eV activation energy in fresh devices changes its nature to interacting defect after the off-state stress, accompanied by an activation energy change. These results are consistent with trap generation in the near-surface AlGaN region at the gate edge related to high electric field and gate leakage current, as stressing does not result in the generation of cracks in the AlGaN layer. |
Sponsorship | IEEE Electron Devices Society |
Starting Page | 662 |
Ending Page | 664 |
Page Count | 3 |
File Size | 396313 |
File Format | |
ISSN | 07413106 |
Volume Number | 31 |
Issue Number | 7 |
Language | English |
Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Publisher Date | 2010-07-01 |
Publisher Place | U.S.A. |
Access Restriction | One Nation One Subscription (ONOS) |
Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Subject Keyword | Integrated optics Charge carrier processes Aluminum gallium nitride Gallium nitride HEMTs MODFETs Stress Optical buffering Degradation Electroluminescence trapping Electrical stress electroluminescence (EL) GaN high-electron mobility transistor (HEMT) impurity diffusion reliability |
Content Type | Text |
Resource Type | Article |
Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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