NDLI: Simple and Accurate Models for Capacitance Considering Floating Metal Fill Insertion

Content Provider	IEEE Xplore Digital Library
Author	Youngmin Kim Petranovic, D. Sylvester, D.
Copyright Year	1993
Abstract	In this paper, we analyze and model the impact of floating dummy fill on the signal capacitance considering various parameters including signal dimensions, dummy shape and dimensions. Intra-layer dummy has its greatest impact on coupling capacitance while inter-layer dummy has larger impact on the ground capacitance component. Based on this analysis, we propose simple capacitance models (Cc for intra-layer dummy and Cg for inter-layer dummy). To consider realistic cases with both signals and metal fill in adjacent layers, we apply a weighting function approach to the Cg model. We verify this model using benchmark circuits and find that total net capacitance with floating fill can be extracted within ~1% of field solver results on average with total extraction runtime reductions of up to 40%. When evaluating the incremental capacitance due to fill alone, average error of the models range from 2%-15% across benchmarks and fill-related runtime overhead is reduced by 60%-88%.
Sponsorship	IEEE Computer Society Association for Computing Machinery (ACM)/SIGDA IEEE Computer Society Technical Committee on Design Automation
Starting Page	1166
Ending Page	1170
Page Count	5
File Size	484903
File Format	PDF
ISSN	10638210
Volume Number	17
Issue Number	8
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-08-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Signal analysis Integrated circuit interconnections Crosstalk Parasitic capacitance Shape Runtime Very large scale integration Silicon Delay Degradation inter connects Capacitance design integrated circuits (ICs)
Content Type	Text
Resource Type	Article
Subject	Electrical and Electronic Engineering Software Hardware and Architecture

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