NDLI: Device-level hermetic packaging of microresonators by RTP aluminum-to-nitride bonding

Content Provider	IEEE Xplore Digital Library
Author	Chiao, M. Lin, L.
Copyright Year	1992
Abstract	This paper presents a device-level microelectromechanical systems (MEMS) packaging process with accelerated tests and reliability analysis. Surface-micromachined microresonators are sealed inside microcavities by a rapid thermal processing (RTP) aluminum-to-silicon nitride bonding and packaging technique. Chip-to-chip bonding is used to form packages both under atmospheric pressure and in vacuum. The hermeticity of the package seals are evaluated by IPA (isopropyl alcohol) leak tests. The vacuum seal is evaluated by measuring the Q-factor (quality factor) of the packaged microresonators. The measured Q-factor of a vacuum-packaged comb-resonator is 1800/spl plusmn/200, corresponding to a 200 motor vacuum inside the micro cavity, and has not degraded over 37 weeks of shelf-life. The reliability information is evaluated by combining accelerated testing of the packages in a harsh environment (an autoclave chamber, 130/spl deg/C, 2.7 atm and 100% RH) and statistical analysis. The mean-time-to-failure (MTTF) of the packaged device is estimated as 29.7 weeks in an autoclave chamber, and tests on vacuum-packaged devices have confirmed the estimation.
Sponsorship	IEEE Electron Devices Society American Society of Mechanical Engineering (ASME)
Starting Page	515
Ending Page	522
Page Count	8
File Size	1372694
File Format	PDF
ISSN	10577157
Volume Number	15
Issue Number	3
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-06-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Packaging Microcavities Bonding Q factor Life estimation Seals Testing Atmospheric measurements Semiconductor device measurement Microelectromechanical systems wafer bonding Aluminum-to-silicon nitride bonding microelectromechanical systems (MEMS) packaging vacuum packaging and accelerated testing
Content Type	Text
Resource Type	Article
Subject	Mechanical Engineering Electrical and Electronic Engineering

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