NDLI: Laser Bonding of Glass to Silicon Using Polymer for Microsystems Packaging

Content Provider	IEEE Xplore Digital Library
Author	Bardin, F. Kloss, S. Changhai Wang Moore, A.J. Jourdain, A. De Wolf, I. Hand, D.P.
Copyright Year	1992
Abstract	Laser joining is a promising technique for wafer-level bonding. It avoids subjecting the complete microelectromechanical system (MEMS) package to a high temperature and/or the high electric field associated with conventional wafer-level bonding processes, using the laser to provide only localized heating. We demonstrate that a benzocyclobutene (BCB) polymer, used as an intermediate bonding layer in the packaging of MEMS devices, can be satisfactorily cured by using laser heating with a substantial reduction of curing time compared with an oven-based process. A glass-on-silicon (Si) cavity bonded with a BCB ring can be produced in a few seconds at a typical laser intensity of 1 W/mm² resulting in a local temperature of ~300degC. Hermeticity and bond strength tests show that such cavities have similar or better performance than cavities sealed by commercial substrate bonders. The influence of exposure time, laser power, and applied pressure on the degree of cure, bond strength, and hermeticity is investigated. The concept of using a large area uniform laser beam together with a simple mirror mask is tested, demonstrating that such a mask is capable of protecting the center of the cavity from the laser beam; however, to prevent lateral heating via conduction through the Si, a high-conductivity heat sink is required to be in good thermal contact with the rear of the Si.
Sponsorship	IEEE Electron Devices Society American Society of Mechanical Engineering (ASME)
Starting Page	571
Ending Page	580
Page Count	10
File Size	1439563
File Format	PDF
ISSN	10577157
Volume Number	16
Issue Number	3
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2007-06-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Glass Silicon Polymers Packaging Wafer bonding Wafer scale integration Temperature Ring lasers Testing Laser beams wafer bonding Laser bonding microelectromechanical system (MEMS) packaging
Content Type	Text
Resource Type	Article
Subject	Mechanical Engineering Electrical and Electronic Engineering

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