NDLI: Analysis of RF MEMS switch packaging Process for yield improvement

Content Provider	IEEE Xplore Digital Library
Author	Mercado, L.L. Kuo, S.-M. Tien-Yu Lee Lee, R.
Copyright Year	1999
Abstract	Radio frequency microelectro-mechanical systems (RF MEMS) switches offer significant performance advantages in high-frequency RF applications. The switches are actuated by electrostatic force when voltage was applied to the electrodes. Such devices provide high isolation when open and low contact resistance when closed. However, during the packaging process, there are various possible failure modes that may affect the switch yield and performance. The RF MEMS switches were first placed in a package and went through lid seal at 320degC. The assembled packages were then attached to a printed circuit board at 220degC. During the process, some switches failed due to electrical shorting. Interestingly, more failures were observed at the lower temperature of 220degC rather than 320degC. The failure mode was associated with the shorting bar and the cantilever design. Finite element simulations and simplified analytical solutions were used to understand the mechanics driving the behaviors. Simulation results have shown excellent agreement with experimental observations and measurements. Various solutions in package configurations were explored to overcome the hurdles in MEMS packaging and achieve better yield and performance
Sponsorship	IEEE Components, Packaging, and Manufacturing Technology Society IEEE Components, Packaging and Manufacturing Technology Society
Starting Page	134
Ending Page	141
Page Count	8
File Size	1057967
File Format	PDF
ISSN	15213323
Volume Number	28
Issue Number	1
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2005-02-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Switches Radiofrequency microelectromechanical systems Packaging Radio frequency Electrostatics Voltage Electrodes Contact resistance Seals Assembly yield Buckling electrical failure finite element simulation microelectro-mechanical systems (MEMS) switch packaging process radio frequency microelectro-mechanical systems (RF MEMS) shorting bar stiction thermal effect
Content Type	Text
Resource Type	Article
Subject	Electrical and Electronic Engineering

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