NDLI: High electromagnetic shielding of plastic package for 2.5-Gb/s optical transceiver modules

Content Provider	IEEE Xplore Digital Library
Author	Tzong-Lin Wu Cheng-Wei Lin Wen-Chi Hung Chien-Hui Lee Wern-Shiarng Jou Wood-Hi Cheng
Copyright Year	1999
Abstract	A lightweight, low-cost plastic package for a 2.5-Gb/s optical transceiver module, that also has good electromagnetic shielding properties, has been fabricated using woven continuous carbon fiber (CCF) epoxy composite. The shielding effectiveness (SE) of the CCF epoxy composite has been modeled theoretically and measured from 500 MHz to 3 GHz using the ASTM D4935 and a near-field test method. Two types of weaving patterns were studied: a balanced twill structure (BTS) and a parallel structure. The BTS was able to achieve an SE of about 80 dB under plane wave conditions and about 50 dB under near-field conditions because of the numerous conductive between crossing fibers. The SE of the proposed package is at least 20 dB greater than the previous package which used a liquid crystal polymer composite. In addition to better shielding performance, the proposed package costs less because it uses less carbon fiber. The proposed package for an optical transceiver is suitable for use in a low-cost lightwave transmission system
Sponsorship	IEEE Components, Packaging, and Manufacturing Technology Society IEEE Components, Packaging and Manufacturing Technology Society
Starting Page	89
Ending Page	95
Page Count	7
File Size	780211
File Format	PDF
ISSN	15213323
Volume Number	28
Issue Number	1
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2005-02-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Electromagnetic shielding Plastic packaging Transceivers High speed optical techniques Electromagnetic interference Carbon dioxide Optical polymers Costs Carbon compounds Optical fiber testing shielding effectiveness (SE) Electromagnetic interference (EMI) optical packages optical transceiver modules plastic composites plastic packages
Content Type	Text
Resource Type	Article
Subject	Electrical and Electronic Engineering

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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