NDLI: Compact packaging of optical and electronic components for on-board optical interconnects

Content Provider	IEEE Xplore Digital Library
Author	Han Seo Cho Kun-Mo Chu Saekyoung Kang Sung Hwan Hwang Byung Sup Rho Weon Hyo Kim Joon-Sung Kim Jang-Joo Kim Hyo-Hoon Park
Copyright Year	1999
Abstract	An optical interconnection plate was developed in order to achieve a compact and cost-effective interconnection module for an optical data link between chips on printed circuit boards. On the silica substrate, transmission lines and solder bumps are formed on the top surface of the substrate, and polymer waveguide array with 45/spl deg/ mirror planes is formed on the back side. This optical interconnection plate technique makes the alignment procedure quite simple and economical, because all the alignment steps between the optical components can be achieved in wafer processes and a high accuracy flip-chip bonding technique. We confirmed the sufficiently high coupling efficiency and low optical crosstalk using the simplified experimental setup. Flip-chip bonding of the vertical-cavity surface-emitting laser and photodiode arrays on the top surface of the optical interconnection plate was performed using indium bumps in order to avoid thermal damage of the polymer waveguide. The fully packaged optical interconnection plate showed an optical data link at rates of 455 Mb/s. Improvement of the mirror surface roughness and the mirror angle accuracy could lead to an optical link at higher rates. In addition, the interconnection system can be easily constructed by inserting the optical interconnection plate between the processing chips or data lines requiring optical links.
Sponsorship	IEEE Components, Packaging, and Manufacturing Technology Society IEEE Components, Packaging and Manufacturing Technology Society
Starting Page	114
Ending Page	120
Page Count	7
File Size	883877
File Format	PDF
ISSN	15213323
Volume Number	28
Issue Number	1
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2005-02-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Optical interconnections Electronics packaging Optical devices Electronic components Optical crosstalk Optical surface waves Optical waveguides Optical polymers Surface waves Mirrors simulation Flip-chip devices hybrid integrated circuit bonding indium optical coupling optical interconnections optical polymers packaging
Content Type	Text
Resource Type	Article
Subject	Electrical and Electronic Engineering

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