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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Kohriki, T. Ikegami, Y. Akimoto, T. Hara, K. Iwata, Y. Kato, Y. Kondo, T. Nakano, I. Ohsugi, T. Shimma, S. Takashima, R. Tanaka, R. Terada, S. Ujiie, N. Unno, Y. |
| Copyright Year | 1963 |
| Abstract | A novel hybrid structure for the barrel module of the ATLAS semiconductor tracker (SCT) is developed. The hybrid carries 12 bare readout chips totaling 1536 channels. A flexible copper-polyimide four-layer lamination is used as a basic circuit. The circuit is reinforced by two carbon-carbon bridges coated with Parylene polymer. The hybrid staffed by resistors, capacitors, and pitch-adaptors undergoes heat cycling and quality inspections. The hybrid after chip mounting and wire bonding is placed over the top and bottom sides of the module assembly with no direct contact to silicon sensors. The electrical, mechanical, as well as thermal performances of the module are proven to be excellent. |
| Sponsorship | IEEE Nuclear and Plasma Sciences Society Computer Applications in Nuclear and Plasma Sciences (CANPS) Lawrence Berkeley Lab. Lawrence Livermore Nat. Lab. APS College of William and Mary Continuous Electron Beam Accelerator Facility NASA Defence Nuclear Agency Sandia National Laboratories Jet Propulsion Laboratory Brookhaven Nat. Lab. Lawrence Livermore Nat. Lab IEEE/NPPS Radiat. Effects Committee Defence Nuclear Agency/DoD Sandia National Laboratories/DOE Jet Propulsion Laboratory/NASA Phillips Lab./DoD |
| Starting Page | 3278 |
| Ending Page | 3283 |
| Page Count | 6 |
| File Size | 606672 |
| File Format | |
| ISSN | 00189499 |
| Volume Number | 49 |
| Issue Number | 6 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2002-12-01 |
| Publisher Place | U.S.A. |
| Access Restriction | One Nation One Subscription (ONOS) |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Lamination Flexible printed circuits Bridge circuits Polymer films Resistors Capacitors Inspection Wire Bonding Assembly |
| Content Type | Text |
| Resource Type | Article |
| Subject | Nuclear and High Energy Physics Electrical and Electronic Engineering Nuclear Energy and Engineering |
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