NDLI: Solder joint reliability of high I/O ceramic-ball-grid arrays and ceramic quad-flat-packs in computer environments: the PowerPC 603/sup TM/ and PowerPC 604/sup TM/ microprocessors

Content Provider	IEEE Xplore Digital Library
Author	Gerke, R.D. Kromann, G.B.
Copyright Year	1999
Abstract	Recent trends in wafer fabrication techniques have produced devices with smaller feature dimensions, increasing gate count and chip inputs/outputs (I/Os). This trend has placed increased emphasis on microelectronics packaging. Surface-mountable packages such as the ceramic quad-flat-pack (CQFP) have provided solutions for many high I/O package issues. As the I/O count gets higher, the pitch has been driven smaller to the point where other solutions also become attractive. Surface-mountable ceramic-ball-grid array (CBGA) packages have proven to be good solutions in a variety of applications as designers seek to maximize electrical performance, reduce printed-circuit board real estate, and improve manufacturing process yields. In support of the PowerPC 603 and PowerPC 604 microprocessors, 21 mm CBGA (255 I/Os) and 32 mm (240 I/Os) and 40 mm (304 I/Os) CQFPs are being utilized. Both package types successfully meet computer environment applications. This paper describes test board assembly processes, accelerated thermal stress test setup, and solder joint failure criteria. Failure mechanisms for both packaging technologies will also be presented. The packages discussed in this paper were subjected to two accelerated thermal cycling conditions: 0 to 100/spl deg/C and -40 to 125/spl deg/C. The failure data are plotted using Weibull distributions. The accelerated failure distributions were used to predict failure distributions in application space for typical PowerPC 603 and PowerPC 604 microprocessors computer environments. To predict solder joint reliability of surface-mount technology, a key parameter is: the temperature rise above ambient at the solder joint, /spl Delta/T. In-situ field temperature measurements were taken for a range of computer platforms in an office environment, at the central-processing units. Printed-circuit boards (PCB) were not uniform, therefore only maximum temperature regions of the board were measured. These maximum temperatures revealed the mean to be less than 20/spl deg/C above ambient (i.e., /spl Delta/T<20/spl deg/C) regardless of the power of the device. The largest /spl Delta/T measured in any system was less than 30/spl deg/C above ambient. These temperature measurements of actual computer systems are in close agreement with IPC-SM-785. By utilizing the measured PCB temperature rise, solder joint fatigue life was calculated for the 21 mm ceramic ball-aid-array (CBGA), the package for the PowerPC 603/sup TM/ and PowerPC 604/sup TM/ RISC microprocessors. The average on-off /spl Delta/T for most computer applications is approximately 20/spl deg/C. For an average on-off /spl Delta/T of 30/spl deg/C, the 21 mm CBGA has an estimated fatigue life of over 25 years while the 32 mm and 40 mm CQFP's have an estimated fatigue life of over 50 years.
Sponsorship	IEEE Components, Packaging, and Manufacturing Technology Society
Starting Page	488
Ending Page	496
Page Count	9
File Size	328730
File Format	PDF
ISSN	15213331
Volume Number	22
Issue Number	4
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1999-12-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Soldering Packaging Temperature measurement Microprocessors Operating systems Life estimation Fatigue Ceramics Computer applications Application software
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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