NDLI: Recent advances in the development of no-flow underfill encapsulants-a practical approach towards the actual manufacturing application

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Recent advances in the development of no-flow underfill encapsulants-a practical approach towards the actual manufacturing application

Content Provider	IEEE Xplore Digital Library
Author	Songhua Shi Wong, C.P.
Copyright Year	1999
Abstract	No-flow underfill technology has been proven to have potential advantages over the conventional underfill technology, and a no-flow underfill material (called G25) has been developed and reported in our prior papers. In this paper, two modified no-flow underfill materials are studied. Compared to the G25 no-flow underfill material, these two materials can be fully post-cured at the temperature below 170/spl deg/C. These two materials also exhibit lower coefficient of thermal expansion (CTE), lower moisture absorption, better adhesion, and more fluxing stability. In this study, a differential scanning calorimetry (DSC) is used to study the curing kinetics and glass transition temperature (DSC Tg) of the two materials. Thermo-mechanical analyzer (TMA) is used to investigate the heat distortion temperature (TMA Tg) and the coefficient of thermal expansion (CTE). Dynamic-mechanical analyzer (DMA) is used to measure the storage modulus (E') and loss modulus (E") within the temperature range from 25/spl deg/C to 250/spl deg/C and then estimate the cross-linking density (p) of the cured material system. Rheometer is used to investigate the material viscosity. Die shear testing is conducted to investigate the adhesive strength between the cured underfill material and polyimide passivation layer. Surface mount technology (SMT) reflow oven, quartz chips and copper laminated FR4 substrates are used to in-situ test the processability of the two materials. Scanning electron microscopy (SEM) is used to observe the integrity of the reflowed solder interconnects. A potential approach toward the production application of no-flow underfill material is then proposed.
Sponsorship	IEEE Components, Packaging, and Manufacturing Technology Society International Microelectronics Assembly and Packaging Society (IMAPS)
Starting Page	331
Ending Page	339
Page Count	9
File Size	191199
File Format	PDF
ISSN	1521334X
Volume Number	22
Issue Number	4
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1999-10-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Conducting materials Temperature Paper technology Thermal expansion Material storage Materials testing Surface-mount technology Scanning electron microscopy Moisture Absorption
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electrical and Electronic Engineering

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