NDLI: Separation of low molecular siloxanes for electronic application by liquid-liquid extraction

Content Provider	IEEE Xplore Digital Library
Author	Urasaki, N. Wong, C.P.
Copyright Year	1999
Abstract	Silicone resins are widely used for electronic packaging as potting and encapsulating materials. Silicone resins have many advantages for electronic packaging applications such as superior electrical properties, thermal stability, low water absorption, etc. Furthermore, silicone resins are not only used as protective materials for integrated circuit (IC) devices but also as conducting materials for interconnection. However, silicone resins have two big drawbacks: low adhesion strength and low molecular weight creep. A simple liquid-liquid extraction method has been developed to purify silicone resins, which will improve adhesion strength and eliminate low molecular weight creep. This paper describes the results of the liquid-liquid extraction method to remove low molecular weight cyclic siloxanes. Fourier transform-infrared (FT-lR) spectroscopy was used to monitor the removal rate of low molecular weight cyclic siloxanes. Thermogravimetric analysis (TGA) was used to evaluate the purity of silicone resin. Gas chromatography-mass spectrometry (GC/MS) was used to identify the low molecular weight cyclic siloxanes. Thermomechanical analyzer (TMA), dynamic mechanical analyzer (DMA), and die shear test were used for evaluate the properties of silicone resin.
Sponsorship	IEEE Components, Packaging, and Manufacturing Technology Society International Microelectronics Assembly and Packaging Society (IMAPS)
Starting Page	295
Ending Page	298
Page Count	4
File Size	55100
File Format	PDF
ISSN	1521334X
Volume Number	22
Issue Number	4
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1999-10-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Resins Conducting materials Electronics packaging Adhesives Creep Spectroscopy Electronic packaging thermal management Circuit stability Thermal stability Water
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electrical and Electronic Engineering

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