NDLI: Modeling ceramic filled polymer integrated capacitor formation using neural networks

Content Provider	IEEE Xplore Digital Library
Author	Thongvigitmanee, T. May, G.S.
Copyright Year	1999
Abstract	Integrated decoupling capacitors for MCM-L/D technology are an important component for next-generation electronic packaging applications. This paper presents a statistically designed experiment for systematic characterization of the dielectric constant and loss tangent of integrated capacitors formed by mixing lead magnesium niobate (PMN) particles into polyimide and benzocyclobutene (BCB) polymer dielectric layers. We determine these quantities as a function of the type of polymer material, a volume fraction of ceramic in the polymer matrix, a polymer cure time, and polymer cure temperature. These factors have been examined by means of a D-optimal experiment. Results indicate manipulation of each of the four factors over the ranges examined lead to considerable variation in dielectric constant and loss tangent. Based on data from these experiments, we train neural networks to model this process variation as a function of above variables. Using this methodology, we determine proper combinations of polymer/ceramic materials and processing conditions to achieve desirable electrical properties.
Sponsorship	IEEE Components, Packaging, and Manufacturing Technology Society International Microelectronics Assembly and Packaging Society (IMAPS)
Starting Page	314
Ending Page	318
Page Count	5
File Size	203023
File Format	PDF
ISSN	1521334X
Volume Number	22
Issue Number	4
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1999-10-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Ceramics Polymers Capacitors Dielectric losses Dielectric constant Dielectric materials Electronics packaging Magnesium Niobium compounds Polyimides
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electrical and Electronic Engineering

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