NDLI: Surface micromachining for microelectromechanical systems

Content Provider	IEEE Xplore Digital Library
Author	Bustillo, J.M. Howe, R.T. Muller, R.S.
Copyright Year	1963
Abstract	Surface micromachining is characterized by the fabrication of micromechanical structures from deposited thin films. Originally employed for integrated circuits, films composed of materials such as low-pressure chemical-vapor-deposition polycrystalline silicon, silicon nitride, and silicon dioxides can be sequentially deposited and selectively removed to build or "machine" three-dimensional structures whose functionality typically requires that they be freed from the planar substrate. Although the process to accomplish this fabrication dates from the 1960's, its rapid extension over the past few years and its application to batch fabrication of micromechanisms and of monolithic microelectromechanical systems (MEMS) make a thorough review of surface micromachining appropriate at this time. Four central issues of consequence to the MEMS technologist are: (i) the understanding and control of the material properties of microstructural films, such as polycrystalline silicon, (ii) the release of the microstructure, for example, by wet etching silicon dioxide sacrificial films, followed by its drying and surface passivation, (iii) the constraints defined by the combination of micromachining and integrated-circuit technologies when fabricating monolithic sensor devices, and (iv) the methods, materials, and practices used when packaging the completed device. Last, recent developments of hinged structures for postrelease assembly, high-aspect-ratio fabrication of molded parts from deposited thin films, and the advent of deep anisotropic silicon etching hold promise to extend markedly the capabilities of surface-micromachining technologies.
Sponsorship	IEEE Publication
Starting Page	1552
Ending Page	1574
Page Count	23
File Size	499496
File Format	PDF
ISSN	00189219
Volume Number	86
Issue Number	8
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1998-08-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Micromachining Microelectromechanical systems Fabrication Micromechanical devices Semiconductor films Sputtering Silicon compounds Thin film circuits Chemicals Centralized control
Content Type	Text
Resource Type	Article
Subject	Computer Science Electrical and Electronic Engineering

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

The multipurpose integrated electronic processor

Failure modes for stiction in surface-micromachined MEMS

Processing of PZT piezoelectric thin films for microelectromechanical systems

Review: Semiconductor Piezoresistance for Microsystems

Surface-micromachined microoptical elements and systems

Wafer level encapsulation techniques for a MEMS microreactor with integrated heat exchanger

Analysis of failure sources in surface-micromachined MEMS

Recent advances in thin-film silicon devices on sapphire substrates

Fracture of polycrystalline 3C-SiC films in microelectromechanical systems

Surface micromachining for microelectromechanical systems

Similar Documents

The multipurpose integrated electronic processor

Failure modes for stiction in surface-micromachined MEMS

Processing of PZT piezoelectric thin films for microelectromechanical systems

Review: Semiconductor Piezoresistance for Microsystems

Surface-micromachined microoptical elements and systems

Wafer level encapsulation techniques for a MEMS microreactor with integrated heat exchanger

Analysis of failure sources in surface-micromachined MEMS

Recent advances in thin-film silicon devices on sapphire substrates

Fracture of polycrystalline 3C-SiC films in microelectromechanical systems

Surface micromachining for microelectromechanical systems