NDLI: Thermal performance of an integral immersion cooled multichip module package

Content Provider	IEEE Xplore Digital Library
Author	Nelson, R.D. Sommerfeldt, S. Bar-Cohen, A.
Copyright Year	1994
Abstract	A multichip module (MCM) package was constructed that uses integral immersion cooling to transfer heat from the chips to a final heat transfer medium outside the package. The package is a miniature immersion cooled system with a pin-fin condenser that can be operated in either the submerged or vapor-space condensing mode. Sixteen chips were bonded on a 57-mm-square alumina substrate carrying copper/polyimide thin-film interconnect. Tests of the thermal performance of the system show that it is capable of handling over 160 W power with chip thermal resistances, based on chip area, as low as 2 K-cm/sup 2//watt provided by the immersion cooled portion of the thermal path. Tests have been performed with the module fully powered and with subsets of the chips powered. The results indicate that the heat transfer coefficient is similar in all partially powered modes. Data taken with condenser temperatures ranging from 20/spl deg/C to 50/spl deg/C were used to obtain a performance map delineating the heat transfer regimes in the module and the limits imposed by critical heat flux and condenser performance. The fluid used in the module enclosure was Fluorinert FC72.<>
Sponsorship	Ericsson IEEE Components, Packaging and Manufacturing Technology Society
Starting Page	405
Ending Page	412
Page Count	8
File Size	988420
File Format	PDF
ISSN	10709886
Volume Number	17
Issue Number	3
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1994-09-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Immersion cooling Heat transfer Packaging Thermal resistance Multichip modules Bonding Substrates Copper Polyimides Transistors
Content Type	Text
Resource Type	Article
Subject	Engineering

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