NDLI: Silver-induced volatile species generation from conductive die attach adhesives

Content Provider	IEEE Xplore Digital Library
Author	Phillips, T.E. deHaas, N. Goodwin, P.G. Benson, R.C.
Copyright Year	1978
Abstract	Commercial and model epoxy die-attach adhesives, with and without silver filler, were investigated to examine the effect the silver filler has on the outgassing characteristics of the organic matrix. The materials were subjected to typical temperature processing schedules including cure, preseal bake, and burn-in. The volatile species outgassing during each of the processing periods were analyzed by gas chromatography/mass spectrometry. Thermogravimetric and calorimetric analyses were also performed. It was determined that silver in the adhesive leads to a greater mass loss and a marked change in the outgassing species relative to the same adhesive system without silver.<>
Sponsorship	IEEE Electronic Industries Alliance American Society of Mechanical Engineering (ASME) NBS SAE
Starting Page	956
Ending Page	963
Page Count	8
File Size	792733
File Format	PDF
ISSN	01486411
Volume Number	15
Issue Number	6
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1992-12-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Microassembly Silver Polyimides Polymers Chemicals Conducting materials Conductivity Temperature Curing Coatings
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electronic, Optical and Magnetic Materials Engineering Electrical and Electronic Engineering

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