NDLI: Rheology of Silver- Filled Glass Die Attach Adhesive for High-Speed Automatic Processing

Content Provider	IEEE Xplore Digital Library
Author	Bell Jr., G. Rosell, C. Joslin, S.
Copyright Year	1978
Abstract	Conductive adhesives for use on high-speed automatic application equipment require well-controlled viscoelastic properties. The theological properties of a new silver/glass die attach adhesive for cerdip packages under a wide range of flow conditions are described. The theology required to achieve dispersion stability and excellent performance under high-speed automatic die bonding conditions is discussed. The adhesive paste is a concentrated dispersion of silver and glass particles in an organic solvent medium. Interparticle interactions promote formation of a three-dimensional solidlike structure at a low shear rate to provide long-term dispersion stability. Under moderate to high shear the dispersion becomes a fluid which shear thins and dispenses readily for application. After dispensing, the paste structure recovers rapidly, retaining the shape of the adhesive pattern. The viscoelastic response of the adhesive was measured under both steady and oscillatory shear to define flow behavior during the different shear/time conditions of the application process: storage, filling, dispensing, pulloff, pattern retention, and die attachment.
Sponsorship	IEEE Electronic Industries Alliance American Society of Mechanical Engineering (ASME) NBS SAE
Starting Page	507
Ending Page	510
Page Count	4
File Size	593892
File Format	PDF
ISSN	01486411
Volume Number	10
Issue Number	4
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1987-12-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Rheology Glass Microassembly Viscosity Elasticity Silver Stability Conductive adhesives Packaging machines Solvents
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electronic, Optical and Magnetic Materials Engineering Electrical and Electronic Engineering

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