NDLI: Determination of Temperature of Integrated-Circuit Chips in Hybrid Packaging

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Determination of Temperature of Integrated-Circuit Chips in Hybrid Packaging

Content Provider	IEEE Xplore Digital Library
Author	Er-Yung Yu
Copyright Year	1971
Abstract	This paper describes an infrared technique and an analogical method to determine the maximum temperature of a beam-leaded integrated-circuit chip, mounted on a ceramic carrier. The infrared technique employs a color thermogram camera to map the stepwise temperature distribution of a heated surface. From the color-digitized thermograms the chip temperature rise over the ambient air can be computed with the aid of thermocouple measurements. The color thermograms also help evaluate the thermal resistances of the chip and the ceramic carrier, which are used in the thermoelectric analogical analysis of steady-state heat flow from the chip t,o the surrounding air under free convection condition. The chip temperature rise as evaluated by the thermoelectric analysis checks reasonably well with the infrared and thermocouple measurements. These two methods have their respective advantages in determining the temperature of integrated-circuit chips.
Starting Page	139
Ending Page	146
Page Count	8
File Size	2000886
File Format	PDF
ISSN	03611000
Volume Number	12
Issue Number	2
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1976-06-01
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Packaging Ceramics Infrared heating Electrical resistance measurement Semiconductor device measurement Thermoelectricity Cameras Temperature distribution Color Thermal resistance
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electronic, Optical and Magnetic Materials Engineering Electrical and Electronic Engineering

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