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Effect of lubricant environment on saw damage in silicon wafers
| Content Provider | NASA Technical Reports Server (NTRS) |
|---|---|
| Author | Shih, K. K. Kuan, T. S. Vanvechten, J. A. Westdorp, W. A. |
| Copyright Year | 1982 |
| Description | The chemomechanical effect of lubricant environments on the inner diameter (ID) sawing induced surface damage in Si wafers was tested for four different lubricants: water, dielectric oil, and two commercial cutting solutions. The effects of applying different potential on Si crystals during the sawing were also tested. It is indicated that the number and depth of surface damage are sensitive to the chemical nature of the saw lubricant. It is determined that the lubricants that are good catalysts for breaking Si bonds can dampen the out of plane blade vibration more effectively and produce less surface damage. Correlations between the applied potential and the depth of damage in the dielectric oil and one of the commercial cutting solutions and possible mechanisms involved are discussed. |
| File Size | 543788 |
| Page Count | 8 |
| File Format | |
| Alternate Webpage(s) | http://archive.org/details/NASA_NTRS_Archive_19820015782 |
| Archival Resource Key | ark:/13960/t55f3nb91 |
| Language | English |
| Publisher Date | 1982-02-01 |
| Access Restriction | Open |
| Subject Keyword | Energy Production And Conversion Chemical Machining Crystal Growth Semiconductor Devices Surface Defects Wafers Lubricating Oils Slicing Vibration Effects Silicon Damage Saws Blades Cutters Ntrs Nasa Technical Reports Server (ntrs) Nasa Technical Reports Server Aerodynamics Aircraft Aerospace Engineering Aerospace Aeronautic Space Science |
| Content Type | Text |
| Resource Type | Article |
