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System for slicing wafers
| Content Provider | NASA Technical Reports Server (NTRS) |
|---|---|
| Copyright Year | 1982 |
| Description | A newly patented process for slicing silicon wafers that has distinct advantages over methods now widely used is described. The primary advantage of the new system is that it allows the efficient slicing of a number of ingots simultaneously at high speed. The cutting action is performed mechanically, most often with diamond particles that are transported to the cutting zone by a fluid vehicle or have been made an integral part of the blade by plating or impregnation. The new system uses a multiple or ganged band saw, arranged and spaced so that each side, or length, segment of a blade element, or loop, provides a cutting function. Each blade is maintained precisely in position by guides as it enters and leaves each ingot. The cutting action is performed with a conventional abrasive slurry composed of diamond grit suspended in an oil- or water-based vehicle. The distribution system draws the slurry from the supply reservoir and pumps it to the injection tubes to supply it to each side of each ingot. A flush system is provided at the outer end of the work-station zone. In order to reduce potential damage, a pneumatically driven flushing fluid is provided. |
| File Size | 142233 |
| Page Count | 6 |
| File Format | |
| Alternate Webpage(s) | http://archive.org/details/NASA_NTRS_Archive_19820015794 |
| Archival Resource Key | ark:/13960/t27990j5m |
| Language | English |
| Publisher Date | 1982-02-01 |
| Access Restriction | Open |
| Subject Keyword | Energy Production And Conversion Solar Arrays Diamonds Microelectronics Saws Blades Cutters Cutting Wafers Silicon Machine Tools Abrasives Manufacturing Ingots Slurries Ntrs Nasa Technical Reports Server (ntrs) Nasa Technical Reports Server Aerodynamics Aircraft Aerospace Engineering Aerospace Aeronautic Space Science |
| Content Type | Text |
| Resource Type | Article |
