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Multi-wire slurry wafering demonstrations. [slicing silicon ingots for solar arrays
| Content Provider | NASA Technical Reports Server (NTRS) |
|---|---|
| Author | Chen, C. P. |
| Copyright Year | 1978 |
| Description | Ten slicing demonstrations on a multi-wire slurry saw, made to evaluate the silicon ingot wafering capabilities, reveal that the present sawing capabilities can provide usable wafer area from an ingot 1.05m/kg (e.g. kerf width 0.135 mm and wafer thickness 0.265 mm). Satisfactory surface qualities and excellent yield of silicon wafers were found. One drawback is that the add-on cost of producing water from this saw, as presently used, is considerably higher than other systems being developed for the low-cost silicon solar array project (LSSA), primarily because the saw uses a large quantity of wire. The add-on cost can be significantly reduced by extending the wire life and/or by rescue of properly plated wire to restore the diameter. |
| File Size | 10235758 |
| Page Count | 96 |
| File Format | |
| Alternate Webpage(s) | http://archive.org/details/NASA_NTRS_Archive_19780012677 |
| Archival Resource Key | ark:/13960/t92854d2j |
| Language | English |
| Publisher Date | 1978-02-22 |
| Access Restriction | Open |
| Subject Keyword | Energy Production And Conversion Performance Tests Solar Arrays Cost Estimates Solar Energy Conversion Wafers Production Engineering Slicing Reliability Engineering Energy Policy Wire Saws System Effectiveness Ntrs Nasa Technical Reports Server (ntrs) Nasa Technical Reports Server Aerodynamics Aircraft Aerospace Engineering Aerospace Aeronautic Space Science |
| Content Type | Text |
| Resource Type | Technical Report |
