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Id wafering technology
| Content Provider | NASA Technical Reports Server (NTRS) |
|---|---|
| Author | Aharonyan, P. |
| Copyright Year | 1982 |
| Description | Improvements in ID saws leading to lower costs for producing silicon wafers for solar cells are described. The relationships between crystal size and blade size and between the length of time it takes to slice a wafer and wafer thickness are discussed. The influence of ingot production methods on wafering performance is considered. A cost sensitivity analysis of slicing a 10 cm square ingot and economic analyses of slicing a four inch and a six inch ingot are presented. A wafering cost model based on the IPEG 2 is given. |
| File Size | 384890 |
| Page Count | 11 |
| File Format | |
| Alternate Webpage(s) | http://archive.org/details/NASA_NTRS_Archive_19820015779 |
| Archival Resource Key | ark:/13960/t1mh2fg26 |
| Language | English |
| Publisher Date | 1982-02-01 |
| Access Restriction | Open |
| Subject Keyword | Energy Production And Conversion Economics Thickness Costs Wafers Technology Assessment Slicing Mathematical Models Silicon Ingots Saws Ntrs Nasa Technical Reports Server (ntrs) Nasa Technical Reports Server Aerodynamics Aircraft Aerospace Engineering Aerospace Aeronautic Space Science |
| Content Type | Text |
| Resource Type | Article |
