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Investigation of solder cracking problems on printed circuit boards
| Content Provider | NASA Technical Reports Server (NTRS) |
|---|---|
| Copyright Year | 1967 |
| Description | A Solder Committee designated to investigate a solder cracking phenomena occurring on the SATURN electrical/electronic hardware found the cause to be induced stress in the soldered connections rather than faulty soldering techniques. The design of the printed circuit (PC) board assemblies did not allow for thermal expansion of the boards that occurred during normal operation. The difference between the thermal expansion properties of the boards and component lead materials caused stress and cracking in the soldered connections. The failure mechanism and various PC boards component mounting configurations are examined in this report. Effective rework techniques using flanged tubelets, copper tubelets, and soft copper wiring are detailed. Future design considerations to provide adequate strain relief in mounting configurations are included to ensure successful solder terminations. |
| File Size | 1071833 |
| Page Count | 24 |
| File Format | |
| Alternate Webpage(s) | http://archive.org/details/NASA_NTRS_Archive_19670027454 |
| Archival Resource Key | ark:/13960/t8dg1gt2f |
| Language | English |
| Publisher Date | 1967-09-01 |
| Access Restriction | Open |
| Subject Keyword | Circuit Board Thermal Stress Crack Soldered Joint Printed Circuit Ntrs Nasa Technical Reports Server (ntrs) Nasa Technical Reports Server Aerodynamics Aircraft Aerospace Engineering Aerospace Aeronautic Space Science |
| Content Type | Text |
| Resource Type | Technical Report |
