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Magellan/galileo solder joint failure analysis and recommendations
| Content Provider | NASA Technical Reports Server (NTRS) |
|---|---|
| Author | Ross Jr., Ronald G. |
| Copyright Year | 1989 |
| Description | On or about November 10, 1988 an open circuit solder joint was discovered in the Magellan Radar digital unit (DFU) during integration testing at Kennedy Space Center (KSC). A detailed analysis of the cause of the failure was conducted at the Jet Propulsion Laboratory leading to the successful repair of many pieces of affected electronic hardware on both the Magellan and Galileo spacecraft. The problem was caused by the presence of high thermal coefficient of expansion heat sink and conformal coating materials located in the large (0.055 inch) gap between Dual Inline Packages (DIPS) and the printed wiring board. The details of the observed problems are described and recommendations are made for improved design and testing activities in the future. |
| File Size | 2654568 |
| Page Count | 43 |
| File Format | |
| Alternate Webpage(s) | http://archive.org/details/NASA_NTRS_Archive_19900007841 |
| Archival Resource Key | ark:/13960/t6wx29441 |
| Language | English |
| Publisher Date | 1989-09-15 |
| Access Restriction | Open |
| Subject Keyword | Function Space Printed Circuits Circuit Boards Design Analysis Thermal Expansion Magellan Spacecraft Nasa Failure Analysis Spacecraft Maintenance Coating Soldered Joints Heat Sinks Spacecraft Design Galileo Spacecraft Failure Ntrs Nasa Technical Reports Server (ntrs) Nasa Technical Reports Server Aerodynamics Aircraft Aerospace Engineering Aerospace Aeronautic Space Science |
| Content Type | Text |
| Resource Type | Technical Report |
