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Solder-circuitry separation problems associated with plated printed circuit boards
| Content Provider | NASA Technical Reports Server (NTRS) |
|---|---|
| Copyright Year | 1971 |
| Description | Investigation of soldered component failure in plated printed circuit boards consisting of tinned laminate copper, plated copper, and gold overplate |
| File Size | 11018229 |
| Page Count | 49 |
| File Format | |
| Alternate Webpage(s) | http://archive.org/details/NASA_NTRS_Archive_19710015239 |
| Archival Resource Key | ark:/13960/t3hx63c01 |
| Language | English |
| Publisher Date | 1971-05-01 |
| Access Restriction | Open |
| Subject Keyword | Electronic Equipment Ntrs Nasa Technical Reports ServerĀ (ntrs) Nasa Technical Reports Server Aerodynamics Aircraft Aerospace Engineering Aerospace Aeronautic Space Science |
| Content Type | Text |
| Resource Type | Technical Report |