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Rugged microelectronic module package supports circuitry on heat sink
| Content Provider | NASA Technical Reports Server (NTRS) |
|---|---|
| Copyright Year | 1966 |
| Description | Rugged module package for thin film hybrid microcircuits incorporated a rigid, thermally conductive support structure, which serves as a heat sink, and a lead wire block in which T-shaped electrical connectors are potted. It protects the circuitry from shock and vibration loads, dissipates internal heat, and simplifies electrical connections between adjacent modules. |
| File Size | 139738 |
| Page Count | 2 |
| File Format | |
| Alternate Webpage(s) | http://archive.org/details/NASA_NTRS_Archive_19660000244 |
| Archival Resource Key | ark:/13960/t7kq2r904 |
| Language | English |
| Publisher Date | 1966-06-01 |
| Access Restriction | Open |
| Subject Keyword | Electronic Components And Circuits Ntrs Nasa Technical Reports ServerĀ (ntrs) Nasa Technical Reports Server Aerodynamics Aircraft Aerospace Engineering Aerospace Aeronautic Space Science |
| Content Type | Text |
| Resource Type | Technical Report |