NDLI: Improving the Thermal Performance of a Forced Convection Air Cooled Solution: Part 2 — Effect on System-Level Performance

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Improving the Thermal Performance of a Forced Convection Air Cooled Solution: Part 2 — Effect on System-Level Performance

Improving the Thermal Performance of a Forced Convection Air Cooled Solution: Part 1 — Modification of Heat Sink Assembly

Integration of a Multiple-Condenser Loop Heat Pipe in a Compact Air-Cooled Heat Sink

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Effect of Fin Interruptions on Natural Convection Heat Transfer From a Rectangular Interrupted Single-Wall

Experimental Study of the Convective Heat Transfer From a Geometrically Scaled Up 2D Impinging Synthetic Jet

Comparative Numerical Analysis of Angled Branching Microchannel Heat Sink

Correlation Between Behaviors of the Vapor Bubbles and the Characteristics of the Heat Transfer Over the Heated Surface on MEB

A Parametric Numerical Study in Cylindrical Oblique Fin Minichannel

Experimental Measurement of the Thermal Performance of a Two-Die 3D Integrated Circuit (3D IC)

Advanced Natural Convection Cooling Designs for LED Bulb Systems

Impact of Material Properties on Cooling COP of Integrated Thermoelectric Microcoolers

A Flow Visualization Study on the Temperature Oscillations Inside a Loop Heat Pipe With Flat Evaporator

Anticipatory Thermoelectric Cooling of a Transient Germanium Hotspot

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Improving the Thermal Performance of a Forced Convection Air Cooled Solution: Part 2 — Effect on System-Level Performance

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Fernandes, John Edward Ghalambor, Saeed Eiland, Richard Agonafer, Dereje Mulay, Veerendra
Copyright Year	2013
Abstract	The heat sink assembly of an air cooled CPU is modified to improve thermal performance of the module-level solution. This modification is employed in a dual-socket server that relies on system fans to move air for forced convection cooling of all heat generating components on the motherboard. Currently, in the data center industry, the focus is on reducing power consumption through application of energy-efficient cooling solutions. Fans installed in the server operate as a function of CPU die temperatures and represent a parasitic load that must be minimized. Improvement in system-level performance can be quantified in terms of reduced fan and server power consumption. The server is subjected to varying CPU utilizations and corresponding average fan speeds and power consumption are reported. Similarly, reduction in CPU junction temperature and server power at a given utilization can be computed by operating the fans at a constant speed. Difference in thermal performance and power consumption between the baseline and modified heat sink configurations was found to negligible when a TIM is applied. However, in the absence of a TIM, the modified assembly delivered as much as 24.4% reduction in CPU die temperature and 6.2% reduction in server power consumption. In addition, there is indiscernible variation in server power consumption between the baseline (with employment of TIM) and modified (with and without TIM application) heat sink assemblies. Thus, the modified configuration has possible applications in systems where a TIM may be undesirable or difficult to apply.
Sponsorship	Electronic and Photonic Packaging Division
File Format	PDF
ISBN	9780791855768
DOI	10.1115/IPACK2013-73107
Volume Number	Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems
Conference Proceedings	ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
Language	English
Publisher Date	2013-07-16
Publisher Place	Burlingame, California, USA
Access Restriction	Subscribed
Subject Keyword	Interfacial pressure Tim performance Back plate Power consumption Server Energy consumption Fans Data centers Forced convection Temperature Heat Cooling Manufacturing Heat sinks Junctions Pressure Stress
Content Type	Text
Resource Type	Article

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