NDLI: Novel Immersion Cooling Technique for a 3D Chip Stack

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Sinha, Ashish Kota, Krishna Hidalgo, Pablo Joshi, Yogendra Glezer, Ari
Copyright Year	2013
Abstract	An experimental investigation of a scheme for cooling electronics packaged in a 3D stack arrangement will be presented in this paper. The scheme utilizes immersion cooling of the stacked electronics in an enclosure filled with a dielectric fluid. Convection and conduction within the dielectric fluid drive heat from the 3D stack to the walls of the enclosure from where a ‘synthetic jet /fan air-cooled heat sink’ ultimately dissipates heat to the ambient. Four layers of thick film heaters embedded in FR-4 sheets, each attached to thin copper plates (innovatively stacked in a pyramidal arrangement for conducting heat laterally to the dielectric fluid and simultaneously promoting natural convection in the fluid), were used to simulate a 3D stack of electronics. For a comparative study, several runs were carried out, where the enclosure was filled with dielectric fluid (FC-770), FC-770 in combination with copper wool (with a goal of enhancing heat transfer in FC-770), and water. For a 40 W total power input to the stack, it was observed that the thermal resistance for heat dissipation to ambient from the four heaters varied from 1.67 K/W to 1.96 K/W with FC-770, 1.47 K/W to 1.87 K/W with FC-770 combined with copper wool, and 1.06 K/W to 1.50 K/W with water. The proposed cooling solution is passive and scalable, and is demonstrated to be practicable and effective in cooling 3D stacked electronics.
Sponsorship	Electronic and Photonic Packaging Division
File Format	PDF
ISBN	9780791855768
DOI	10.1115/IPACK2013-73039
Volume Number	Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems
Conference Proceedings	ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
Language	English
Publisher Date	2013-07-16
Publisher Place	Burlingame, California, USA
Access Restriction	Subscribed
Subject Keyword	Water Cooling Thick films Electronics Natural convection Convection Heat conduction Fluids Heat Thermal resistance Energy dissipation Plates (structures) Copper Heat sinks Heat transfer
Content Type	Text
Resource Type	Article

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