NDLI: Numerical Simulation of Conjugate Heat Transfer From Multiple Electronic Module Packages Cooled by Air

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Yoshino, Hideo Fujii, Motoo Zhang, Xing Behnia, Masud
Copyright Year	2003
Abstract	This paper reports on the numerical simulation of conjugate heat transfer from multiple electronic module packages (45 × 45 × 2.4 mm) on a printed circuit board placed in a duct. The dimensions of the modules are the same as a single module package previously studied. In the series arrangement, two module packages are installed on the center of the printed circuit board along the airflow direction. In the parallel arrangement, two and/or four module packages are installed normal to the airflow direction. In the numerical simulations, the interval between the module packages was varied and three values were considered (45, 22.5 and 9 mm). The variation of the printed circuit board thermal conductivity was also considered and 0.3, 3 and 20 W/m/K were used with the mean velocity in the duct also at three different values (0.33, 0.67 and 1 m/s). In order to derive a non-dimensional correlation from the numerical results, the concept of the effective heat transfer area previously used for a single module package was used for the multiple module packages. For the series arrangement, the effects of the interval on the effective heat transfer area are relatively low, and the numerical results can be summarized with the same correlation obtained from the single module package. On the other hand, the effective heat transfer area for the parallel arrangement is strongly affected by the parallel interval and the thermal conductivity of printed circuit board. When the interval increases, the temperature of the module packages greatly reduces as the thermal conductivity of the printed circuit board increases.
Sponsorship	Electronic and Photonic Packaging Division
Starting Page	331
Ending Page	336
Page Count	6
File Format	PDF
ISBN	0791836908
DOI	10.1115/IPACK2003-35144
e-ISBN	0791836746
Volume Number	2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2
Conference Proceedings	ASME 2003 International Electronic Packaging Technical Conference and Exhibition
Language	English
Publisher Date	2003-07-06
Publisher Place	Maui, Hawaii, USA
Access Restriction	Subscribed
Subject Keyword	Cfd Conjugate heat transfer Multiple chips Effective heat transfer area Computer simulation Heat transfer
Content Type	Text
Resource Type	Article

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